HM1-65799H/883
vs
5962-9322503MXX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
,
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
Access Time-Max |
|
25 ns
|
JESD-30 Code |
|
R-GDIP-T28
|
Memory Density |
|
262144 bit
|
Memory Width |
|
4
|
Number of Functions |
|
1
|
Number of Terminals |
|
28
|
Number of Words |
|
65536 words
|
Number of Words Code |
|
64000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
|
64KX4
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Parallel/Serial |
|
PARALLEL
|
Screening Level |
|
MIL-STD-883
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Position |
|
DUAL
|
|
|
|
Compare HM1-65799H/883 with alternatives
Compare 5962-9322503MXX with alternatives