HM1-65767BM/883
vs
TD2114AL-4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
INTEL CORP
|
| Package Description |
,
|
DIP, DIP18,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
18
|
| Access Time-Max |
|
200 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-GDIP-T18
|
| JESD-609 Code |
|
e0
|
| Length |
|
22.86 mm
|
| Memory Density |
|
4096 bit
|
| Memory Width |
|
4
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
18
|
| Number of Words |
|
1024 words
|
| Number of Words Code |
|
1000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
1KX4
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
NO
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP18,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Parallel/Serial |
|
PARALLEL
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
NMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
|
|
|
Compare HM1-65767BM/883 with alternatives
Compare TD2114AL-4 with alternatives