HM1-65162C-2
vs
WS128K32V-25G4MA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTERSIL CORP
WHITE MICROELECTRONICS
Package Description
DIP, DIP24,.6
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
120 ns
25 ns
I/O Type
COMMON
JESD-30 Code
R-XDIP-T24
S-CQFP-F68
JESD-609 Code
e0
Memory Density
16384 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
8
Number of Terminals
24
68
Number of Words
2048 words
524288 words
Number of Words Code
2000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
512KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0004 A
Standby Voltage-Min
2 V
Supply Current-Max
0.07 mA
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Base Number Matches
3
2
Additional Feature
USER CONFIGURABLE AS 128K X 32 OR 256K X 16
Number of Functions
1
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
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