HIP6602BCRZ-T
vs
HIP6602BCR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFN, SOIC
|
QFN
|
| Package Description |
HVQCCN, LCC16,.20SQ,32
|
HVQCCN, LCC16,.2SQ,32
|
| Pin Count |
16, 14
|
16
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Peak Current Limit-Nom |
0.73 A
|
0.73 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.20SQ,32
|
LCC16,.2SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
13.2 V
|
13.2 V
|
| Supply Voltage-Min |
10.8 V
|
10.8 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Supply Voltage1-Max |
12 V
|
12 V
|
| Supply Voltage1-Min |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare HIP6602BCRZ-T with alternatives
Compare HIP6602BCR with alternatives