HIP6601BECBZ
vs
HIP6601BCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTERSIL CORP
ROCHESTER ELECTRONICS INC
Part Package Code
SOIC
SOIC
Package Description
HLSOP, SOP8,.25
SOP,
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.89 mm
4.9 mm
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Output Peak Current Limit-Nom
0.73 A
0.73 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HLSOP
SOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.68 mm
1.75 mm
Supply Voltage-Max
13.2 V
13.2 V
Supply Voltage-Min
10.8 V
10.8 V
Supply Voltage-Nom
12 V
12 V
Supply Voltage1-Max
12 V
12 V
Supply Voltage1-Min
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
2
2
Pbfree Code
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