HIP6601BCBZ
vs
HIP6601BECBZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTERSIL CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
Package Description
GREEN, PLASTIC, MS-012AA, SOIC-8
SOIC-8
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
4.9 mm
4.89 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Output Peak Current Limit-Nom
0.73 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HLSOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1.68 mm
Supply Voltage-Max
13.2 V
13.2 V
Supply Voltage-Min
10.8 V
10.8 V
Supply Voltage-Nom
12 V
12 V
Supply Voltage1-Max
12 V
Supply Voltage1-Min
5 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.9 mm
Base Number Matches
2
2
Date Of Intro
2017-11-01
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