HIP2101IRZT
vs
HIP2101IRZT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTERSIL CORP
RENESAS ELECTRONICS CORP
Part Package Code
DFN, QFN, SOIC
QFN
Package Description
HVQCCN, LCC16,.2SQ,32
HVQCCN,
Pin Count
12, 16, 8
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
26 Weeks, 1 Day
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
S-XQCC-N16
S-XQCC-N16
JESD-609 Code
e3
e3
Length
5 mm
5 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Peak Current Limit-Nom
2 A
2 A
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC16,.2SQ,32
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max
14 V
14 V
Supply Voltage-Min
9 V
9 V
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Turn-off Time
0.056 µs
0.056 µs
Turn-on Time
0.056 µs
0.056 µs
Width
5 mm
5 mm
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
L16.5X5
Samacsys Manufacturer
Renesas Electronics
Compare HIP2101IRZT with alternatives
Compare HIP2101IRZT with alternatives