HI2-0200-2
vs
DG200ABA
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
SILICONIX INC
|
Package Description |
, CAN10,.23
|
, CAN10,.23
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
O-MBCY-W10
|
O-MBCY-W10
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Normal Position |
NC
|
NC
|
Number of Channels |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
10
|
10
|
Off-state Isolation-Nom |
70 dB
|
|
On-state Resistance-Max (Ron) |
70 Ω
|
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-25 °C
|
Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
Package Body Material |
METAL
|
METAL
|
Package Equivalence Code |
CAN10,.23
|
CAN10,.23
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
|
Switch-off Time-Max |
500 ns
|
|
Switch-on Time-Max |
500 ns
|
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
3
|
4
|
Part Package Code |
|
BCY
|
Pin Count |
|
10
|
|
|
|
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