DG200ABA
vs
HI2-0200-5
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SILICONIX INC
|
INTERSIL CORP
|
| Part Package Code |
BCY
|
BCY
|
| Package Description |
, CAN10,.23
|
METAL CAN-10
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
O-MBCY-W10
|
O-MBCY-W10
|
| JESD-609 Code |
e0
|
e0
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NC
|
NC
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
METAL
|
METAL
|
| Package Equivalence Code |
CAN10,.23
|
CAN10,.23
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
4
|
4
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
70 dB
|
| On-state Resistance-Max (Ron) |
|
70 Ω
|
| Surface Mount |
|
NO
|
|
|
|
Compare DG200ABA with alternatives
Compare HI2-0200-5 with alternatives