HI1837C-Y-000
vs
H23C32CP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HUGHES AIRCRAFT
HUGHES AIRCRAFT
Package Description
,
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
120 ns
JESD-30 Code
R-GDIP-T24
R-PDIP-T24
Memory Density
65536 bit
16777216 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
1MX16
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.052 mA
0.035 mA
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Additional Feature
2 CHIP SELECT SIGNALS; STATIC CMOS
Output Characteristics
3-STATE
Compare HI1837C-Y-000 with alternatives
Compare H23C32CP with alternatives