HI1-574ALD-8
vs
SP574BAL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
SIPEX CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
25 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0244%
|
| Negative Supply Voltage-Nom |
-12 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP28,.6
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.92 mm
|
4.57 mm
|
| Supply Voltage-Nom |
12 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
11.505 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
11.505 mm
|
| Sample Rate |
|
0.04 MHz
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
Compare HI1-574ALD-8 with alternatives
Compare SP574BAL with alternatives