HEF4517BPB vs HEF4517BDF feature comparison

HEF4517BPB NXP Semiconductors

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HEF4517BDF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 21.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type SERIAL IN SERIAL OUT SERIAL IN SERIAL OUT
Number of Bits 64 64
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 440 ns 440 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 2 MHz 2 MHz
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16

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Compare HEF4517BDF with alternatives