HEF4517BD vs CD4517BFX feature comparison

HEF4517BD NXP Semiconductors

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CD4517BFX Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code DIP
Package Description DIP, DIP16,.3 ,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type SERIAL IN SERIAL OUT SERIAL IN SERIAL OUT
Number of Bits 64 64
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 440 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
fmax-Min 2 MHz
Base Number Matches 2 4
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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