HEF4517BD
vs
CD4517BFMSR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER
OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER
Count Direction
RIGHT
RIGHT
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
SERIAL IN SERIAL OUT
SERIAL IN SERIAL OUT
Number of Bits
64
64
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
440 ns
540 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
2 MHz
2.22 MHz
Base Number Matches
2
2
Rohs Code
No
JESD-609 Code
e0
Max Frequency@Nom-Sup
3000000 Hz
Screening Level
38535V;38534K;883S
Terminal Finish
TIN LEAD
Compare HEF4517BD with alternatives
Compare CD4517BFMSR with alternatives