HEF4516BDF
vs
HEF4516BDB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT
TCO OUTPUT
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
290 ns
290 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
18 MHz
3 MHz
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Compare HEF4516BDF with alternatives
Compare HEF4516BDB with alternatives