HEF4512BPB vs CD4512BCJ feature comparison

HEF4512BPB NXP Semiconductors

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CD4512BCJ Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 280 ns 750 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Length 19.43 mm
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare CD4512BCJ with alternatives