HEF4511BP,652 vs SN74F138DG4 feature comparison

HEF4511BP,652 NXP Semiconductors

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SN74F138DG4 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.25
Pin Count 16 16
Manufacturer Package Code SOT38-4
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family 4000/14000/40000 F/FAST
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e4 e4
Length 21.6 mm 9.9 mm
Logic IC Type SEVEN SEGMENT DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 310 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
ECCN Code EAR99
Additional Feature TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS
Max I(ol) 0.02 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 20 mA
Prop. Delay@Nom-Sup 9 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare HEF4511BP,652 with alternatives

Compare SN74F138DG4 with alternatives