HEF4066BDB vs TC4016BP feature comparison

HEF4066BDB NXP Semiconductors

Buy Now Datasheet

TC4016BP Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Package Description DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 5 Ω 7 Ω
On-state Resistance-Max (Ron) 175 Ω 400 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Current-Max (Isup) 0.03 mA 0.03 mA
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 140 ns 30 ns
Switch-on Time-Max 30 ns 30 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 14
JESD-609 Code e0
Length 19.25 mm
Terminal Finish TIN LEAD

Compare HEF4066BDB with alternatives

Compare TC4016BP with alternatives