HEF4052BT,013
vs
HEF4052BTT,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOP
|
TSSOP
|
| Package Description |
SOP-16
|
TSSOP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT109-1
|
SOT403-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance Match-Nom |
25 Ω
|
25 Ω
|
| On-state Resistance-Max (Ron) |
2500 Ω
|
2500 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP16,.25
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
0.6 mA
|
0.6 mA
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
190 ns
|
190 ns
|
| Switch-on Time-Max |
260 ns
|
260 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
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