HEF4044BDF
vs
HEF4044BPN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
185 ns
185 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.7 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
LOW LEVEL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Length
21.6 mm
Package Equivalence Code
DIP16,.3
Packing Method
BULK
Peak Reflow Temperature (Cel)
245
Prop. Delay@Nom-Sup
185 ns
Time@Peak Reflow Temperature-Max (s)
40
Compare HEF4044BDF with alternatives
Compare HEF4044BPN with alternatives