HEF4031BPB
vs
CD4031BCN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING
DELAYED BUFFERED CLOCK OUTPUT FOR CASCADING
Count Direction
RIGHT
RIGHT
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
21.6 mm
19.305 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
SERIAL IN SERIAL OUT
SERIAL IN SERIAL OUT
Number of Bits
64
64
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
380 ns
600 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
2.5 MHz
1.6 MHz
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Terminal Finish
TIN LEAD
Compare HEF4031BPB with alternatives
Compare CD4031BCN with alternatives