CD4070BFSR
vs
M38510/05353BCX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA INC
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
XOR GATE
XOR GATE
Max I(ol)
0.00035999999999999997 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
378 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Screening Level
38535V;38534K;883S
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
2
5
Part Package Code
DIP
Pin Count
14
Family
4000/14000/40000
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
350 ns
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Compare CD4070BFSR with alternatives
Compare M38510/05353BCX with alternatives