HEF4030BP,652 vs TC4030BP feature comparison

HEF4030BP,652 NXP Semiconductors

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TC4030BP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4
Length 19.025 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XOR GATE XOR GATE
Max I(ol) 0.00035999999999999997 A 0.012 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 175 ns 280 ns
Propagation Delay (tpd) 175 ns 280 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.2 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Pbfree Code Yes
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.03 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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