HEF4027BPB vs CD4027BMN feature comparison

HEF4027BPB NXP Semiconductors

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CD4027BMN Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 21.6 mm 19.305 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 210 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 4 MHz 2.5 MHz
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Max Frequency@Nom-Sup 2500000 Hz
Package Equivalence Code DIP16,.3
Terminal Finish TIN LEAD

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