HEF4027BPB vs HCC4027BF feature comparison

HEF4027BPB NXP Semiconductors

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HCC4027BF SGS-Ates Componenti Electronici SPA

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SGS-ATES COMPONENTI ELECTRONICI S P A
Part Package Code DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-XDIP-T16
Length 21.6 mm
Load Capacitance (CL) 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 210 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE MASTER-SLAVE
Width 7.62 mm
fmax-Min 4 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Terminal Finish Tin/Lead (Sn/Pb)

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