HEF4022BPN vs M38510/05604BEA feature comparison

HEF4022BPN Philips Semiconductors

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M38510/05604BEA SRI International Sarnoff

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Rohs Code No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer PHILIPS SEMICONDUCTORS SRI INTERNATIONAL
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Load/Preset Input NO YES
Logic IC Type DIVIDE BY 8 COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 3000000 Hz
Max I(ol) 0.00035999999999999997 A
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 6
Part Package Code DIP
Pin Count 16
Family 4000/14000/40000
Number of Bits 8
Propagation Delay (tpd) 3380 ns
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 12.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 10 V
Trigger Type POSITIVE EDGE
fmax-Min 0.35 MHz

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