HEF40193BDB
vs
5962-01-195-6172
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Package Description
DIP,
,
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK
Count Direction
BIDIRECTIONAL
Family
4000/14000/40000
JESD-30 Code
R-GDIP-T16
Load Capacitance (CL)
50 pF
Load/Preset Input
YES
Logic IC Type
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
Number of Bits
4
Number of Functions
1
Number of Terminals
16
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Propagation Delay (tpd)
425 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
2.5 MHz
Base Number Matches
1
1
Rohs Code
Compare HEF40193BDB with alternatives
Compare 5962-01-195-6172 with alternatives