HEF40106BDB vs MC54HC20J feature comparison

HEF40106BDB NXP Semiconductors

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MC54HC20J Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER NAND GATE
Number of Functions 6 2
Number of Inputs 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 180 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 14
JESD-609 Code e0
Length 19.495 mm
Terminal Finish TIN LEAD

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