HEF40106BDB vs 5962-01-097-2449 feature comparison

HEF40106BDB NXP Semiconductors

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5962-01-097-2449 Intersil Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6
Number of Inputs 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2
Rohs Code No
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 280 ns
Schmitt Trigger YES
Screening Level 38535Q/M;38534H;883B

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