HD74LV123AFPEL
vs
HD74LV123AFP-EL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HITACHI LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.3
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.06 mm
|
10.06 mm
|
| Logic IC Type |
MONOSTABLE MULTIVIBRATOR
|
MONOSTABLE MULTIVIBRATOR
|
| Number of Data/Clock Inputs |
2
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
42 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.5 mm
|
5.5 mm
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare HD74LV123AFPEL with alternatives
Compare HD74LV123AFP-EL with alternatives