HD74LV08AFPEL-E
vs
TC74LVX08FNEL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Lifetime Buy
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP14,.3
SOP,
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
10.06 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Prop. Delay@Nom-Sup
14 ns
Propagation Delay (tpd)
20 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
2.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.5 mm
3.9 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74LV08AFPEL-E with alternatives
Compare TC74LVX08FNEL with alternatives