HD74LS76ARP vs 74HC75D feature comparison

HD74LS76ARP Hitachi Ltd

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74HC75D NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type J-K FLIP-FLOP D LATCH
Max I(ol) 0.008 A 0.004 A
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -20 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supply Current-Max (ICC) 6 mA
Prop. Delay@Nom-Sup 20 ns 36 ns
Propagation Delay (tpd) 20 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE HIGH LEVEL
Width 3.95 mm 3.9 mm
fmax-Min 30 MHz 60 MHz
Base Number Matches 2 8
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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