74HC75D
vs
74HC75DB-T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SSOP
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16
|
SSOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e4
|
Length |
9.9 mm
|
6.2 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D LATCH
|
D LATCH
|
Max I(ol) |
0.004 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SSOP
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
36 ns
|
|
Propagation Delay (tpd) |
190 ns
|
190 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Trigger Type |
HIGH LEVEL
|
HIGH LEVEL
|
Width |
3.9 mm
|
5.3 mm
|
fmax-Min |
60 MHz
|
60 MHz
|
Base Number Matches |
3
|
2
|
|
|
|
Compare 74HC75D with alternatives
Compare 74HC75DB-T with alternatives