HD74LS73AFP
vs
M38510/06101B2A
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
SRI INTERNATIONAL
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SOP, SOP14,.3
|
QCCN, LCC20,.35SQ
|
| Pin Count |
14
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
10K
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10.06 mm
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
30000000 Hz
|
105000000 Hz
|
| Max I(ol) |
0.008 A
|
|
| Number of Bits |
2
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Equivalence Code |
SOP14,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
6 mA
|
62 mA
|
| Propagation Delay (tpd) |
20 ns
|
5 ns
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
2.2 mm
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
5.5 mm
|
|
| fmax-Min |
30 MHz
|
105 MHz
|
| Base Number Matches |
3
|
1
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare HD74LS73AFP with alternatives
Compare M38510/06101B2A with alternatives