HD74LS373FPEL
vs
DM74LS373WM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP, SOP20,.3
PLASTIC, SO-20
Pin Count
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
12.6 mm
12.8 mm
Load Capacitance (CL)
45 pF
150 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
-20 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP20,.3
SOP20,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
40 mA
40 mA
Prop. Delay@Nom-Sup
18 ns
18 ns
Propagation Delay (tpd)
30 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.65 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
7.5 mm
Base Number Matches
1
4
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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