HD74LS26P
vs
JM38510/30001BCC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
SIGNETICS CORP
Part Package Code
DIP
Package Description
DIP, DIP14,.3
,
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.2 mm
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Output Characteristics
OPEN-COLLECTOR
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
4.4 mA
4.4 mA
Prop. Delay@Nom-Sup
32 ns
Propagation Delay (tpd)
32 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.06 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
1
Load Capacitance (CL)
15 pF
Compare HD74LS26P with alternatives
Compare JM38510/30001BCC with alternatives