JM38510/30001BCC vs SN74LS26J-00 feature comparison

JM38510/30001BCC Philips Semiconductors

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SN74LS26J-00 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP ROCHESTER ELECTRONICS LLC
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 4.4 mA
Propagation Delay (tpd) 15 ns 28 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code DIP
Pin Count 14
Length 19.56 mm
Output Characteristics OPEN-COLLECTOR
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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