HD74LS244P
vs
JM38510/32403BRA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP20,.3
|
CERAMIC, DIP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1986-11-01
|
|
| Control Type |
ENABLE LOW
|
ENABLE LOW
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDIP-T20
|
R-GDIP-T20
|
| Length |
24.5 mm
|
26.92 mm
|
| Load Capacitance (CL) |
45 pF
|
45 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
0.012 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
54 mA
|
54 mA
|
| Prop. Delay@Nom-Sup |
18 ns
|
18 ns
|
| Propagation Delay (tpd) |
18 ns
|
18 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| Count Direction |
|
UNIDIRECTIONAL
|
| JESD-609 Code |
|
e0
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-M-38510 Class B
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HD74LS244P with alternatives
Compare JM38510/32403BRA with alternatives