HD74LS21FPEL
vs
M38510/30009BCX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP14,.3
DIP,
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDSO-G14
R-GDIP-T14
Length
10.06 mm
19.56 mm
Load Capacitance (CL)
15 pF
50 pF
Logic IC Type
AND GATE
NAND GATE
Max I(ol)
0.008 A
0.004 A
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Inputs
4
8
Number of Terminals
14
14
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
4.4 mA
1.1 mA
Prop. Delay@Nom-Sup
20 ns
38 ns
Propagation Delay (tpd)
20 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
2.2 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
7.62 mm
Base Number Matches
1
8
Compare HD74LS21FPEL with alternatives
Compare M38510/30009BCX with alternatives