HD74HC75FP-EL
vs
74HC173DB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
FP-16DA
|
SSOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.06 mm
|
6.2 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.5 mm
|
5.3 mm
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
WITH HOLD MODE
|
| Family |
|
HC/UH
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
4
|
| Number of Functions |
|
1
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
|
53 ns
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Trigger Type |
|
POSITIVE EDGE
|
| fmax-Min |
|
60 MHz
|
|
|
|
Compare HD74HC75FP-EL with alternatives
Compare 74HC173DB with alternatives