Findchips: Compare HD74HC75FP-EL vs 74HC259DB,118

HD74HC75FP-EL vs 74HC259DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	RENESAS ELECTRONICS CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	SSOP1
Package Description	FP-16DA	5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count	16	16
Reach Compliance Code	unknown	compliant
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
Length	10.06 mm	6.2 mm
Logic IC Type	D LATCH	D LATCH
Number of Terminals	16	16
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.2 mm	2 mm
Surface Mount	YES	YES
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	5.5 mm	5.3 mm
Base Number Matches	2	2
Rohs Code		Yes
Manufacturer Package Code		SOT338-1
HTS Code		8542.39.00.01
Additional Feature		1:8 DMUX FOLLOWED BY LATCH
Family		HC/UH
JESD-609 Code		e4
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Number of Bits		1
Number of Functions		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-40 °C
Output Polarity		TRUE
Package Equivalence Code		SSOP16,.3
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		56 ns
Propagation Delay (tpd)		255 ns
Supply Voltage-Max (Vsup)		6 V
Supply Voltage-Min (Vsup)		2 V
Supply Voltage-Nom (Vsup)		5 V
Technology		CMOS
Temperature Grade		AUTOMOTIVE
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
Trigger Type		LOW LEVEL
	Logic » FF/Latches	Logic » FF/Latches