HD74HC75FP-EL vs 74HC173DB feature comparison

HD74HC75FP-EL Hitachi Ltd

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74HC173DB NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 6.2 mm
Logic IC Type D LATCH D FLIP-FLOP
Number of Bits 2 4
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 180 ns 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL POSITIVE EDGE
Width 5.5 mm 5.3 mm
Base Number Matches 1 4
Pbfree Code Yes
Rohs Code Yes
Additional Feature WITH HOLD MODE
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
fmax-Min 60 MHz

Compare HD74HC75FP-EL with alternatives

Compare 74HC173DB with alternatives