HD74HC597T vs TC74HC597AP feature comparison

HD74HC597T Renesas Electronics Corporation

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TC74HC597AP Toshiba America Electronic Components

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Pbfree Code No No
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code TSSOP DIP
Package Description TSSOP-16 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e0
Length 5 mm 19.25 mm
Logic IC Type PARALLEL IN SERIAL OUT PARALLEL IN SERIAL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 220 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 7.62 mm
fmax-Min 31 MHz 60 MHz
Base Number Matches 1 2
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 24000000 Hz
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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