TC74HC597AP
vs
M74HC597F1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
Length
19.25 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
PARALLEL IN SERIAL OUT
PARALLEL IN SERIAL OUT
Max Frequency@Nom-Sup
24000000 Hz
24000000 Hz
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
180 ns
36 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
60 MHz
24 MHz
Base Number Matches
1
2
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare TC74HC597AP with alternatives
Compare M74HC597F1 with alternatives