HD74HC20FP-EL
vs
MC74HC20DR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
SOP, SOP14,.25
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
10.06 mm
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.5 mm
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.004 A
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TAPE AND REEL
|
| Power Supplies |
|
2/6 V
|
| Prop. Delay@Nom-Sup |
|
27 ns
|
| Schmitt Trigger |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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