HD74HC1G08CME vs 74HC1G08GW,125 feature comparison

HD74HC1G08CME Renesas Electronics Corporation

Buy Now Datasheet

74HC1G08GW,125 Nexperia

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP NEXPERIA
Part Package Code SOIC TSSOP
Package Description CMPAK-5 SC-88, 5 PIN
Pin Count 5 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e0 e3
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.002 A
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR, 7 INCH
Prop. Delay@Nom-Sup 25 ns
Propagation Delay (tpd) 125 ns 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Manufacturer Package Code SOT353-1
ECCN Code EAR99
Date Of Intro 1998-11-10
Samacsys Manufacturer Nexperia
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC1G08CME with alternatives

Compare 74HC1G08GW,125 with alternatives