74HC1G08GW,125
vs
MC74HC1G08DFR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
MOTOROLA INC
Part Package Code
TSSOP
Package Description
SC-88, 5 PIN
TSSOP,
Pin Count
5
Manufacturer Package Code
SOT353-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
1998-11-10
Samacsys Manufacturer
Nexperia
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
Length
2 mm
2 mm
Logic IC Type
AND GATE
AND GATE
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
135 ns
155 ns
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
1.25 mm
Base Number Matches
2
2
Qualification Status
Not Qualified
Compare 74HC1G08GW,125 with alternatives
Compare MC74HC1G08DFR2 with alternatives