Findchips: Compare HD74HC1G08CME vs 74AHC1G08GW,165

HD74HC1G08CME vs 74AHC1G08GW,165 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	RENESAS ELECTRONICS CORP	NEXPERIA
Part Package Code	SOIC	TSSOP
Package Description	CMPAK-5	TSSOP,
Pin Count	5	5
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	AHC/VHC/H/U/V
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e0	e3
Length	2 mm	2.05 mm
Load Capacitance (CL)	50 pF
Logic IC Type	AND GATE	AND GATE
Max I(ol)	0.002 A
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Equivalence Code	TSSOP5/6,.08
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Prop. Delay@Nom-Sup	25 ns
Propagation Delay (tpd)	125 ns	16 ns
Qualification Status	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	TIN LEAD	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	1.25 mm	1.25 mm
Base Number Matches	2	1
Manufacturer Package Code		SOT353-1
Samacsys Manufacturer		Nexperia
Moisture Sensitivity Level		1
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates