Findchips: Compare 74AHC1G08GW,165 vs 74AHC1G08GW,125

74AHC1G08GW,165 vs 74AHC1G08GW,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	TSSOP	TSSOP
Package Description	TSSOP,	1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Pin Count	5	5
Manufacturer Package Code	SOT353-1	SOT353-1
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.05 mm	2.05 mm
Logic IC Type	AND GATE	AND GATE
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	260
Propagation Delay (tpd)	16 ns	16 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	30
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
Max I(ol)		0.008 A
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		10.5 ns
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates