HD74HC132FP vs TC74HC132AF(TP1) feature comparison

HD74HC132FP Renesas Electronics Corporation

Buy Now Datasheet

TC74HC132AF(TP1) Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 10.3 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 125 ns 28 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.3 mm
Base Number Matches 2 1
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74HC132FP with alternatives

Compare TC74HC132AF(TP1) with alternatives